USB-IF to Feature SuperSpeed USB at CES 2010

News
By ( AVTechnology ) published
  • SuperSpeed USB (USB 3.0) was developed to answer the need for a next generation interconnect with the speed to transfer the immense amount of data consumers create and consume daily. Offering up to 10x the performance of Hi-Speed USB (USB 2.0), enhanced power delivery and improved power efficiency, SuperSpeed USB is now available to consumers seeking a fast, reliable and backward compatible solution. SuperSpeed USB allows users to sync and transfer photos, video, music, documents and other digital content in their lives like never before.
  • CES 2010 is your opportunity to experience SuperSpeed USB firsthand and speak directly with the industry-leading companies bringing the technology to market. Visit the USB Implementers Forum (USB-IF) table at CES Unveiled or the USB TechZone at the Las Vegas Convention Center, which will include 15 exhibiting companies. Please contact USB-IF representatives at press@usb.org with questions or to book a dedicated briefing with USB-IF spokespersons.
  • WHEN: CES Unveiled, January 5, 2010
  • CES 2010, January 7 - 10, 2010
  • Showcase hours:
  • Thursday: 10 a.m.- 6 p.m., Friday - Saturday: 9 a.m.- 6 p.m., Sunday: 9 a.m.- 4 p.m.
  • WHERE: CES Unveiled
  • The Venetian Ballroom, The Venetian Hotel
  • 3355 Las Vegas Blvd., Las Vegas, NV 89109
  • CES 2010: South Hall 3, Upper Level, Booth #30769
  • Las Vegas Convention Center
  • 3150 Paradise Road, Las Vegas, NV 89109
  • The USB TechZone is hosted by the USB-IF. Exhibiting organizations and sponsors include:
  • Arasan Chip Systems
  • DisplayLink Corp.
  • Fresco Logic
  • Fujitsu
  • Genesys Logic
  • I/O Interconnect
  • inXtron, Inc.
  • Jungo Ltd.
  • magicJack
  • Main Super Enterprises Co., Ltd.
  • MCCI
  • NEC Electronics
  • Newnex Technology Corp.
  • Texas Instruments
  • Total Phase
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