- SuperSpeed USB (USB 3.0) was developed to answer the need for a next generation interconnect with the speed to transfer the immense amount of data consumers create and consume daily. Offering up to 10x the performance of Hi-Speed USB (USB 2.0), enhanced power delivery and improved power efficiency, SuperSpeed USB is now available to consumers seeking a fast, reliable and backward compatible solution. SuperSpeed USB allows users to sync and transfer photos, video, music, documents and other digital content in their lives like never before.
- CES 2010 is your opportunity to experience SuperSpeed USB firsthand and speak directly with the industry-leading companies bringing the technology to market. Visit the USB Implementers Forum (USB-IF) table at CES Unveiled or the USB TechZone at the Las Vegas Convention Center, which will include 15 exhibiting companies. Please contact USB-IF representatives at press@usb.org with questions or to book a dedicated briefing with USB-IF spokespersons.
- WHEN: CES Unveiled, January 5, 2010
- CES 2010, January 7 - 10, 2010
- Showcase hours:
- Thursday: 10 a.m.- 6 p.m., Friday - Saturday: 9 a.m.- 6 p.m., Sunday: 9 a.m.- 4 p.m.
- WHERE: CES Unveiled
- The Venetian Ballroom, The Venetian Hotel
- 3355 Las Vegas Blvd., Las Vegas, NV 89109
- CES 2010: South Hall 3, Upper Level, Booth #30769
- Las Vegas Convention Center
- 3150 Paradise Road, Las Vegas, NV 89109
- The USB TechZone is hosted by the USB-IF. Exhibiting organizations and sponsors include:
- Arasan Chip Systems
- DisplayLink Corp.
- Fresco Logic
- Fujitsu
- Genesys Logic
- I/O Interconnect
- inXtron, Inc.
- Jungo Ltd.
- magicJack
- Main Super Enterprises Co., Ltd.
- MCCI
- NEC Electronics
- Newnex Technology Corp.
- Texas Instruments
- Total Phase
